Round pumps for automatic soldering systems and vessel emptying

R6-D85 for automatic soldering systems

For automatic soldering systems like partial soldering units, the electromagnetic round pump R6-D85 is used. The advantage is a laminar flow resulting out of the electromagnetic force and a stable solder column, free of pulsating influence or disturbances.

R6-D85-P for Vessel emptying

The electromagnetic round pump R6-D85 can also be used as submerged or transfer pump mobile and flexible for emptying solder baths, tin baths and lead alloy baths etc.